Technology Platforms Driving Ingredient Innovation

Plamed | Combining advanced formulation science, molecular engineering, and biotechnology to develop high-performance functional ingredient solutions.

Skin Repair Solutions

Skin repair is the foundation of healthy skin, involving tissue regeneration, barrier maintenance and cellular protection. Through continuous research on repair actives and their application value, Plamed has established a full-spectrum repair ingredients system including classic repair, barrier reinforcement, soothing care and innovative repair categories, to meet diverse formulation demands for repair skincare products.

1. Classic repair

Centella asiatica-derived flagship repair solutions

PMRepair® Centella (Total Triterpenes): Classic centella active to support skin recovery and repair

PMRepair® Centella-WS (90% Madecassoside): High-purity centella active widely used in repair formulations

Centella Asiatica Extract: Natural plant-derived repair ingredient with dual repair and soothing benefits, suitable for diverse repair formulas

2. Barrier reinforcement

Sustain healthy and stable skin barrier function

Ceramide: Reinforces skin barrier structure and reduces transepidermal water loss

Ectoin: Stabilizes cells and enhances skin adaptability to environmental stress

3. Soothing repair

Alleviate skin discomfort, fragility and adverse conditions induced by environmental irritants

Bisabolol: Classic soothing ingredient to relieve skin irritation

4. Innovative repair

Develop novel repair actives and synergistic combinations with classic repair ingredients to inspire new repair product development

PMSoothe® Kava97: Innovative repair active that generates synergistic effects with centella extract.

Products

Bisabolol

Bisabolol

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Centella Asiatica Extract

Centella Asiatica Extract

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Ceramide

Ceramide

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Ectoin

Skin Repair Ingredient PMRepair® Centella

Skin Repair Ingredient PMRepair® Centella

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Skin Repair Ingredient PMRepair® Centella-WS

Skin Repair Ingredient PMRepair® Centella-WS

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